PCB Magazine / Nov 2014

by GoldBuG posted Jan 16, 2018 Views 605
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The market of active implantable devices requires new strategies in designing and manufacturing the relevant components (e.g., the electronic modules). The request for continuously smaller devices to achieve improved patient comfort with even higher functionalities asks as well for further miniaturization on PCBs (Figure 1). Combining existing PCB manufacturing technology with technologies from the thin film industries allows integration of new functionalities while reducing the footprint and the number of components.