등록 : 2013.10.30 ⋅ 41회 인용
자료요약
카테고리 : 무전해동도금 | 글입력 : goldbug | 최종수정일 : 2013.11.19
Good plating for the small diameter via and through-hole. Excellent inner layer connection reliability even with high temperature soldering. High stability of electroless copper solution.
