수정 일반 도금용 약품 관리

 

 

 

전해탈지

Electrolytic degreasing

• NaOH (Sodium hydroxide)

 

무전해 니켈도금

Electroless Nickel plating

• Ni (pH, nickel)
• NaH₂PO₂ (Sodium hypophosphite)
• N₂H₄ (Hydrazine)

 

무전해 구리도금

Electro copper plating (Copper sulfate bath)

• H₂SO₄, Cu (Sulfuric acid, copper)
• NaOH, HCHO, Cu (Sodium hydroxide, formalin, copper)
• Cl  (chlorine)
• Fe³⁺ (Trivalent iron)

 

구리도금

Electro Copper Plating

• Copper Sulfate/Copper Cyanide/EDTA-Cu
• K/Na Pyrophospate
• H₂SO₄
• NaCN

 

니켈도금

Electro nickel plating

• Ni, Cl (Watts bath, Nickel sulfate, nickel chloride)
• H₃BO₃ (pH, boric acid)

 

설파민산니켈도금

sulfamic acid Nickel bath

• Ni (pH, nickel sulfamate)
• H₃BO₃ (Boric acid)

 

흑니켈도금

Electro alloy plating

• black Ni-Zn
• Zn (Zinc)
• Ni (pH, nickel)

 

아연도금

Zinc plating

• Zincate bath
• Zn, NaOH Zinc (sodium hydroxide)

 

팔라듐도금

Electro palladium plating

• Pd (Palladium)

 

크롬도금

Chrome Plating

• Cr, SO₄ (Chromic Acid, Sulfuric Acid)
• F (HydroFluoborate)