수정  PCB 도금 공정용 약품

^ Chemicals for PCB Process

 

 

Development

• (약품명 → 관리항목)
• Na₂CO₃ → pH, Sodium carbonate, resist
• K₂CO₃ → pH, Potassium carbonate

 

Soft Etching

• Na₂S₂O₈, H₂SO₄, Cu → Sodium Persulfate, sulfuric acid, copper
• H₂O₂, H₂SO₄, Cu → Hydrogen peroxide, sulfuric acid, copper

 

Etching

• CuCl₂ → Hydrochloric acid, cupric chloride

 

Stripping

• NaOH → Sodium hydroxide

 

Desmear

• NaMnO₄, NaOH → Sodium permanganate, sodium hydroxide

 

Catalyst

• Pd → Palladium
• DMAB → Dimethyl amine boran

 

Electroless Copper plating

• NaOH, HCHO, Cu → Sodium hydroxide, formalin, copper

 

Electrolytic copper plating

(Copper sulfate bath)

• H₂SO₄, Cu → Sulfuric acid, copper
• Cl → Chloride
• Fe³⁺ → Trivalent iron

 

Black oxide

• NaClO₂, NaOH → Sodium chlorite, sodium hydroxide
• K₂S₂O₈, NaOH → Potassium persulfate, sodium hydroxide

 

Electroless Nickel Plating

• Ni → pH, nickel
• DMAB → Dimethyl amine boran

 

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