DMAB를 사용한 무전해 Ni-B 합금 도금 I. 오스테나이트 스테인리스강 상의 석출반응에 대한 전기화학적 거동
A study on electroless Ni-B plating with DMAB as reducing agent 1. The electrochemical behavior of precipitation reaction on austenite stainless steel substrates
In today’s electronics-dominated world a lot of different equipment is manufactured. The basis of every electronic device are the so-called PCBs (printed circuit...